Thursday, January 24, 2013

David is Everywhere! VIA APC 3D Boot Camp
Thursday, January 24, 2013

David is Everywhere! VIA APC 3D Boot Camp

David Kuo with Volker Heisterman of Yushan Ventures on stage at VIA APC 3D Boot Camp
Photo from BausteinCentral FB page
https://www.facebook.com/photo.php?fbid=494640820579125&set=pb.457024371007437.-2207520000.1359026113&type=3&theater
The VIA APC Boot Camp was held over the weekend of the 19th and 20th January. It brought together a bunch of techie and DIY computer enthusiasts, popped them in groups and asked them to design ideas around the new VIA APC Paper computer - the VIA APC board presented in a carboard and aluminium box the size of a paperback. For more please go to: http://viaembedded.blogspot.tw/